Popular Design for Low Thermal Conductivity Sponge - O-Cresol Formaldehyde Epoxy Resin – Haitung
Popular Design for Low Thermal Conductivity Sponge - O-Cresol Formaldehyde Epoxy Resin – Haitung Detail:
O-Cresol Formaldehyde Epoxy Resin
Due to the multi-epoxy groups existed in the molecules of O-cresol formaldehyde epoxy resin,a large amount of tight cross-bonds are formed after being cured,resulting in excellent thermalstability,mechanical strength,electricity insulation and chemicals resistance.It is mainly used in microelectronic industry.Widely used for the encapsulant of semiconductors and integrated circuits
Main applications:
—microelectronic industry
—encapsulant of semiconductors and integrated circuits.
CYDCN-200
CYDCN-205
CYDCN-205H
CYDCN-208
Product detail pictures:
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By Ruby
from Oslo
- 2015.09.29 17:23
We always believe that the details decides the company's product quality, in this respect, the company conform our requirements and the goods are meet our expectations.
By Helen
from Jersey
- 2015.05.15 10:52
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